Each party desires to establish internationally compatible sources of a pluggable fiber optic transceiver module in support of standards for fiber optic systems including Asynchronous Transfer Mode (ATM), FDDI, Fibre Channel, Fast Ethernet and Gigabit Ethernet, and Synchronous Optical Network (SONET) / Synchronous Digital Hierarchy (SDH) applications.
Each party further desires to establish uniformity in the industry for the Transceiver “Package Dimensions”, “Cage and Electrical Connector System”, “Host Board Layout”, “Electrical Interfaces”, and “Front Panel Bezel Requirements” as described in Appendices A-B.
Each party expects that the establishment of compatible sources for an interchangeable transceiver module will allow the entire fiber optic marketplace to grow more rapidly. This enhanced marketplace growth, customer choice, and vigorous competition are the express purposes of this Agreement. Each party acknowledges this agreement provides a solution with height as a primary limiting constraint and may not provide an optimum solution for applications with different constraints.
The parties desire to establish compatible sources for additional products in the future.
General
The parties agree to cooperate by supporting common product specifications for pluggable fiber optic transceivers with the package “Package Dimensions”, “Cage and Electrical Connector System”, “Host Board Layout”, “Electrical Interfaces”, and “Front Panel Bezel Requirements” as shown in Appendices A-B. The overall package dimensions shall not exceed the maximum indicated dimensions, and the mounting features shall be located such that the products are mechanically interchangeable with the cage and connector system. In addition the overall dimensions and mounting requirements for the cage and connector system on a circuit board shall be configured such that the products are mechanically and electrically interchangeable.
The electrical and optical specifications shall be compatible with those enumerated in the appropriate standards (i.e. the IEEE 802.3z Gigabit Ethernet standard and the ITU G.957 Synchronous Digital Hierarchy standard). Recommended circuit layouts for electrical input and output terminations, and grounding practices are also described in Appendix B.
The transceivers per this Agreement will accept an optical connector such as the duplex LC, MT-RJ or the SG connector. This Agreement does not preclude any of the parties from offering SFP transceivers with other connectors.
Internal design of the SFP transceiver is entirely at the discretion of each party and is not covered by this Agreement. The parties recognize that their products may not be identical, but need only meet the above criteria.
No license is granted under the patents, know-how, tradesecrets or any other technology of any party to this Agreement either expressly or by implication or by estoppel. Each of the MSA parties have agreed that licenses to all required intellectual property will be made available to all interested parties under reasonable and non-discriminatory terms and conditions applicable to that MSA party. Individual parties to this Agreement may have patents, which they believe may be relevant to this Agreement. The MSA parties should be contacted individually to determine if they have patent rights, which they believe may be pertinent to this Agreement. Each party is free to seek technology or other exchanges with other firms in order to support its activities under this Agreement.
Scope of the Agreement
The scope of this Agreement includes transceivers with transmission rates up to 5.0 Gb/s operating over multimode and single mode fiber.
Each party agrees to be responsible for its own development, manufacturing, marketing and selling in order to supply transceivers meeting the attached specifications.
This Agreement does not preclude any party from offering other products that may not meet the attached specifications.
Each party retains complete liberty regarding its methods of implementing a supply of product, e.g., by engineering effort or by technology licensing or transfer or combination of these or other practices.
Each party also retains sole discretion in its choice of sales channels and distribution.
Each party affirms its intention to compete freely and openly in the marketplace with the parties as well as other competitors.
Each party expects to support products meeting the attached specifications for as long as marketplace conditions warrant. No specific time limit is associated with this Agreement. The determination of market condition suitability is to be made by each party individually and in each party’s sole discretion.
Announcing the Agreement
Each party agrees to announce this Agreement in a manner agreed upon by the parties. These announcements will mention all the parties who have signed this Agreement.
Each party agrees to seek public attention by means of such an announcement.
Each party agrees to contribute time and effort at its sole discretion toward preparing and making such an announcement.
After the Agreement is announced, each party may advertise or otherwise promote this Agreement in any way that it deems appropriate. Mutual consent of the other party is required if such other party is to be mentioned by name.
Other Vendors Matching the Product Configuration
The parties recognize that additional vendors may choose to match the attached product specifications after this Agreement is announced.
Each party recognizes it is desirable and keeping with the intent of the Agreement for such additional vendors to support the transceiver mechanical dimensions and functional attributes described in Appendix A.
Therefore, each party agrees to encourage other vendors to support these product specifications.
Naming Other Vendors
Each party agrees to have written internal procedures that require such party to name the other parties when customers ask who intends to be a source for transceivers as described in this Agreement. Each party agrees for such procedures to require it to name the others regardless as to whether another of the parties has already supplied similar transceiver products to that customer.
An example of suggested wording is: “Agilent, Blaze Networks, E2O, ExceLight, Finisar, Fujikura, Hitachi Cable, Infineon, IBM, Lucent, Molex, OCP, Picolight, Stratos Lightwave, and Tyco have signed a Cooperation Agreement relating to the establishment of Small Form-factor Pluggable transceivers for multimode and single mode fiber operating up to 5.0 Gb/s data rates.”
The parties are not obligated to provide any information other than the identities of the other parties. The requirements of this provision are met entirely if a party has the aforementioned written procedures and they are made available to its sales force in the same way as are other sales related procedures.
Current Product
Should the parties agree to further explore technical and other exchanges pertaining to the products described in this Agreement, then this shall be under a separate agreement.
The parties recognize that at some future time it may become less feasible to offer the products envisioned by this Agreement. A party may withdraw from its commitment to cooperate at its own discretion upon a 90-day notice to the other parties. This notice is necessary to allow the other parties to discontinue mentioning the withdrawing part as a participant in this Agreement and to reconsider any jointly planned promotional activities.
With the exception of disputes arising out of intellectual property issues, no party to this Agreement shall be liable for any indirect, incidental, punitive, or consequential damages, including without limitation, lost profits or changes of good will, or similar losses, even if advised of the possibility of such damages. In addition, each party’s liability under this Agreement for direct damages shall be limited to $10,000.
A1. SFP Transceiver Package Dimensions
A2. Mating of SFP Transceiver PCB to SFP Electrical Connector A3. Host Board Layout
A4. Insertion, Extraction and Retention Forces for SFP Transceivers A5. Labeling of SFP Transceivers
A6. Bezel Design for Systems Using SFP Transceivers A7. SFP Electrical Connector Mechanical Specifications A8. SFP Cage Assembly Dimensions
B1. Introduction B2. Pin Definitions
B3. Timing Requirements of Control and Status I/O
B4. Module Definition Interface and Data Field Description
A common mechanical outline is used for all SFP transceivers. The package dimensions for the SFP transceiver are described in Table 1 and Figures 1A and 1B.
Designator | Dimension (mm) | Tolerance (mm) | Comments |
A | 13.7 | 0.1 | Transceiver width, nosepiece or front that extends inside cage |
B | 8.6 | 0.1 | Transceiver height, front, that extends inside cage |
C | 8.5 | 0.1 | Transceiver height, rear |
D | 13.4 | 0.1 | Transceiver width, rear |
E | 1.0 | Maximum | Extension of front sides outside of cage, see Note 2 Figure 1B |
F | 2.3 | Reference | Location of cage grounding springs from centerline, top |
G | 4.2 | Reference | Location of side cage grounding springs from top |
H | 2.0 | Maximum | Width of cage grounding springs |
J | 28.5 | Minimum | Location of transition between nose piece and rear of transceiver |
K | 56.5 | Reference | Transceiver overall length |
L | 1.1x45 | Minimum | Chamfer on bottom of housing |
M | 2.0 | 0.25 | Height of rear shoulder from transceiver printed circuit board |
N | 2.25 | 0.1 | Location of printed circuit board to bottom of transceiver |
P | 1.0 | 0.1 | Thickness of printed circuit board |
Q | 9.2 | 0.1 | Width of printed circuit board |
R | 0.7 | Maximum | Width of skirt in rear of transceiver |
S | 45.0 | 0.2 | Length from latch shoulder to rear of transceiver |
T | 34.6 | 0.3 | Length from latch shoulder to bottom opening of transceiver |
U | 41.8 | 0.15 | Length from latch shoulder to end of printed circuit board |
V | 2.5 | 0.05 | Length from latch shoulder to shoulder of transceiver outside of cage (location of positive stop). |
W | 1.7 | 0.1 | Clearance for actuator tines |
X | 9.0 | Reference | Transceiver length extending outside of cage, see Note 2 Figure 1B |
Y | 2.0 | Maximum | Maximum length of top and bottom of transceiver extending outside of cage, see Note 2 Figure 1B |
Z | 0.45 | 0.05 | Height of latch boss |
AA | 8.6 | Reference | Transceiver height, front, that extends inside cage |
AB | 2.6 | Maximum | Length of latch boss (design optional) |
AC | 45 | 3 | Entry angle of actuator |
AD | 0.3 | Maximum | Radius on entry angle of actuator |
AE | 6.3 | Reference | Width of cavity that contains the actuator |
AF | 2.6 | 0.05 | Width of latch boss (design optional) |
AG | 0.40 | Minimum | Maximum radius of front of latch boss, 2 places (design optional) |
Notes:
Cage grounding springs permitted in this area and may extend full length of transceiver, 4 places. Grounding springs may contribute a maximum force of 3.5N (Newtons) to the withdrawal force of the transceiver from the cage.
A representative MT-RJ configuration is illustrated. Indicated outline defines the preferred maximum envelope outside of the cage.
Design of actuation method and shape is optional.
Color code: An exposed colored feature of the transceiver (a feature or surface extending outside the cage assembly) shall be color coded as follows:
Black or beige for multi-mode
Blue for single mode
The SFP transceiver contains a printed circuit board that mates with the SFP electrical connector. The pads are designed for a sequenced mating:
First mate – ground contacts
Second mate – power contacts
Third mate – signal contacts
The design of the mating portion of the transceiver printed circuit board is illustrated in Figure 2 and the electrical pad layout is illustrated in Figure 3. A typical contact pad plating for the printed circuit board is 0.38 micrometers minimum hard gold over 1.27 micrometers minimum thick nickel. Other plating options that meet the performance requirements are acceptable.
Top of Board
Bottom of Board (as viewed thru top of board)
1
2
3
4
5
6
7
8
9
10
VeeR
VeeR
LOS
Rate Select
MOD-DEF(0)
MOD-DEF(1)
MOD-DEF(2)
Tx Disable
TxFault
VeeT
20
19
18
17
16
15
14
13
12
11
VeeR
RD-
RD+
VeeR
VccR
VccT
VeeT
TD+
TD-
VeeT
A typical host board mechanical layout for attaching the SFP Connector and Cage System is shown in Figures 4A and 4B.
The requirement for the various functional forces and the durability cycles are specified in Table 2.
Measurement | Minimum | Maximum | Units | Comments |
SFP transceiver insertion | 0 | 40 | Newtons | |
SFP transceiver extraction | 0 | 11.5 | Newtons | |
SFP transceiver retention | 90 | 170 | Newtons | No damage to transceiver below 90N |
Cage retention (Latch strength) | 180 | N/A | Newtons | No damage to latch below 180N |
Cage kickout spring force | 11.5 | 22 | Newtons | |
Insertion / removal cycles, connector/cage | 100 | N/A | cycles | |
Insertion / removal cycles, SFP transceiver | 50 | N/A | cycles |
Color coding requirements for optical SFP transceivers are specified in Figure 1B.
Each SFP transceiver should be clearly labeled. The complete labeling need not be visible when the SFP transceiver is installed. Labeling should include appropriate manufacturing and part number identification, appropriate regulatory compliance labeling, and a clear specification of the external port characteristics. The external port characteristic label may include such information as optical wavelength, required fiber characteristics, operating data rate, interface standards supported, and link length supported.
Host enclosures that use SFP devices should provide appropriate clearances between the SFP transceivers to allow insertion and extraction without the use of special tools and a bezel enclosure with sufficient mechanical strength. For most systems a nominal centerline to centerline spacing of 16.25mm (0.640”) is sufficient. See Figure 5 for the recommended bezel design. For double-sided board mounting, a printed circuit board thickness of 3.0mm (0.118”) is required.
The SFP transceiver insertion slot should be clear of nearby moldings and covers that might block convenient access to the latching mechanisms, the SFP transceiver, or the cables connected to the SFP transceiver.
The SFP Connector is a 20-contact, right angle surface mount connector. It is described in Table 3 and Figure 6. The plating on the contacts is specified as follows:
Contact area: 0.38 micrometers minimum hard gold over 2.54 micrometers minimum thick nickel
Solder terminal area: gold flash or 2.54 micrometers tin lead plating over 2.54 minimum thick nickel.
Designator | Dimension (mm) | Tolerance (mm) | Comments |
A | 9.4 | 0.08 | Connector card slot width |
B | 1.4 | 0.05 | Guide pin diameter |
C | 11.2 | Maximum | Connector width |
D | 9.2 | Maximum | Connector length |
E | 3.5 | Reference | Distance from centerline of connector to outer contact |
F | 3.9 | Reference | Distance from centerline of connector to outer contact |
G | 1.35 | Maximum | Connector card slot height |
H | 2.6 | Minimum | Height from bottom of connector to bottom of card slot |
J | 9.6 | TP | Distance between guide pins |
K | 0.9 | Reference | Diamond guide pin width |
L | 1.4 | 0.05 | Diamond guide pin length |
M | 5.4 | Maximum | Connector height |
N | 0.8 | Reference | Length of solder leads past housing, front & rear |
P | 6.0 | Minimum | Depth of card slot from front face of housing |
Q | 3.0 | Maximum | Depth of contact point from front face of connector |
R | 0.7 | 0.1 | Size of chamfer on top face of connector |
S | 0.3 | Reference | Distance boss extends past front face of connector |
T | 1.0 | Minimum | Size of chamfer at entry of card slot, all around |
U | 4.5 | Reference | Length from centerline of guide posts to end of solder lead |
The SFP Cage Assembly consists of two components: a lower cage that is soldered to the host board and a top cage that is assembled to the lower cage after soldering. A reference drawing describing the SFP Cage Assembly is provided in Table 4 and Figures 7A and 7B. The cage material is copper alloy and plating options are:
Tin-lead plate 2.54 micrometers minimum over copper flash
Tin plate 2.54 micrometers minimum over 0.76 micrometers minimum nickel
Designator | Dimension (mm) | Tolerance (mm) | Comments |
A | 48.8 | Maximum | Overall length |
B | 8.3 | Maximum | Length from inside top of cage to latch |
C | 14.0 | 0.1 | Inside width of cage |
D | 14.25 | Basic | Distance between solderleg centerlines on side of cage |
E | 0.249 | 0.025 | Thickness of solderleg |
F | 9.0 | Basic | Distance between vent holes along length |
G | 11.8 | Basic | Distance from front of cage to beginning of center vent hole row |
H | 7.9 | Basic | Distance between vent holes across the width of the cage |
J | 2.0 | 0.1 | Diameter of vent holes |
K | 16.5 | Basic | Distance from front of cage to solderleg |
L | 10.0 | Basic | Distance between chassis ground solderlegs along side |
M | 0.6 | 0.1 | Width of EMI pins |
N | 0.7 | 0.1 | Width of all chassis ground solderlegs |
P | 2.0 | Maximum | Width of solderleg shoulder |
Q | 1.25 | Maximum | Length of solderleg |
R | 3.95 | Basic | Distance from centerline of cage to centerline of chassis ground solderleg |
S | 1.45 | Basic | Distance from centerline of cage to centerline of chassis ground solderleg |
T | 1.45 | Basic | Distance from centerline of cage to centerline of chassis ground solderleg |
U | 4.8 | Basic | Distance from centerline of cage to centerline of EMI pins |
V | 0.5 | 0.05 | Width of EMI pins on top cage |
W | 9.2 | 0.15 | Distance from inside top of cage to inside bottom surface of front section of cage assembly |
X | 9.8 | Maximum | Maximum height of cage assembly from host board |
Z | 10.0 | Basic | Distance between chassis ground solderlegs along side |
AA | 11.5 | Basic | Distance from front of cage to solderleg |
AB | 7.5 | Minimum | Length of 9.2 (W) dimension from front of cage |
AC | 15.0 | Maximum | Maximum width of cage assembly |
AD | 13.9 | Minimum | Minimum width of inside of cage |
AE | 8.95 | 0.15 | Height of inside of cage assembly |
AF | 1.0 | Minimum | Height of clearance slots |
AG | 2.4 | Basic | Distance of clearance slots from cage centerline |
Designator | Dimension (mm) | Tolerance (mm) | Comments |
AH | 3.0 | 0.1 | Width of clearance slots |
AJ | 2.35 | 0.1 | Distance from front of cage to latch opening |
AK | 2.8 | 0.1 | Length of latch opening |
AL | 0.5 | Minimum | Height of latch lead-in |
AM | 45.6 | Maximum | Distance from front of cage to kickout spring |
AN | 35.0 | Maximum | Distance from front of cage to end of cage floor |
AP | 0.7 | 0.1 | Width of solderlegs that extend from floor of cage |
AQ | 5.1 | Maximum | Width of latch |
AR | 3.0 | 0.05 | Width of latch opening |
AS | 16.3 | Basic | Front of cage to beginning of outer vent hole rows |
AT | 0.65 | Maximum | Inside radius of cage, four places |
AU | 5.8 | Minimum | Distance between panel ground spring supports |
AV | 12.7 | Maximum recommended | Length of plug extending outside of the cage |
AW | 15.75 | Maximum | Width of plug extending outside of the cage |
AX | 10.9 | Maximum | Height of plug extending outside of the cage |
The order to prevent contamination of the internal components and to optimize EMI performance, it is recommended that a Dust/EMI Plug be inserted into cage assemblies when no transceiver is present. The maximum dimensions of the Dust/EMI Cover are listed in Table
4 and the maximum size is illustrated in Figure 7A. The Dust/EMI Cover shall exert a maximum force of 4.0 Newtons per side to the inside surfaces of the cage. This force shall be measured as the force/side required to compress the Dust/EMI Cover’s compliant feature(s) to the maximum dimensions listed in Table 4 (Illustrated in Figure 7A).
This annex contains pin definition data for the small form-factor pluggable (SFP) transceiver. The pin definition data is specific to gigabit rate datacom applications such as Fibre Channel and Gigabit Ethernet. It is expected that different pin definitions will be developed for SONET/ATM and lower data rate datacom applications.
Figure 1 below shows the pin names and numbering for the connector block on the host board. The diagram is in the same relative orientation as the host board layout (see Appendix A, Figure 4.). As mentioned, this pinout only applies to gigabit rate datacom applications. The pin functions are defined in Table 1 and the accompanying notes. Figure 2A shows the recommended power supply filtering network. Figure 2B shows an example of a complete SFP host board schematic with connections to SerDes and protocol ICs. For EMI protection the signals to the 20-pin connector should be shut off when the transceiver is removed. Standard board layout practices such as connections to Vcc and GND with Vias, use of short- and equal-length differential signal lines, use of microstrip-lines and 50 terminations are recommended. Chassis grounds and external electromagnetic interference shields should not be attached to circuit ground.
Towards Bezel
1
2
3
4
5
6
7
8
9
10
20
VeeT
VeeT
TD-
TXFault
TD+
TX Disable
VeeT
MOD-DEF(2)
VccT
MOD-DEF(1)
VccR
MOD-DEF(0)
VeeR
Rate Select
RD+
LOS
RD-
VeeR
VeeR
VeeR
19
18
17
16
15 Towards ASIC
14
13
12
11
Pin Num. | Name | Function | Plug Seq. | Notes |
1 | VeeT | Transmitter Ground | 1 | |
2 | TX Fault | Transmitter Fault Indication | 3 | Note 1 |
3 | TX Disable | Transmitter Disable | 3 | Note 2 Module disables on high or open |
4 | MOD-DEF2 | Module Definition 2 | 3 | Note 3, 2 wire serial ID interface |
5 | MOD-DEF1 | Module Definition 1 | 3 | Note 3, 2 wire serial ID interface |
6 | MOD-DEF0 | Module Definition 0 | 3 | Note 3, Grounded in Module |
7 | Rate Select | Select between full or reduced receiver bandwidth | 3 | Note 4 Low or Open – reduced bandwidth, High– full bandwidth |
8 | LOS | Loss of Signal | 3 | Note 5 |
9 | VeeR | Receiver Ground | 1 | Note 6 |
10 | VeeR | Receiver Ground | 1 | Note 6 |
11 | VeeR | Receiver Ground | 1 | Note 6 |
12 | RD- | Inv. Received Data Out | 3 | Note 7 |
13 | RD+ | Received Data Out | 3 | Note 7 |
14 | VeeR | Receiver Ground | 1 | Note 6 |
15 | VccR | Receiver Power | 2 | 3.3 5%, Note 8 |
16 | VccT | Transmitter Power | 2 | 3.3 5%, Note 8 |
17 | VeeT | Transmitter Ground | 1 | Note 6 |
18 | TD+ | Transmit Data In | 3 | Note 9 |
19 | TD- | Inv. Transmit Data In | 3 | Note 9 |
20 | VeeT | Transmitter Ground | 1 | Note 6 |
Plug Seq.: Pin engagement sequence during hot plugging.
TX Fault is an open collector/drain output, which should be pulled up with a 4.7K – 10K resistor on the host board. Pull up voltage between 2.0V and VccT, R+0.3V. When high, output indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.
TX disable is an input that is used to shut down the transmitter optical output. It is pulled up within the module with a 4.7 – 10 K resistor. Its states are:
Low (0 – 0.8V): Transmitter on
(>0.8, < 2.0V): Undefined
High (2.0 – 3.465V): Transmitter Disabled Open: Transmitter Disabled
Mod-Def 0,1,2. These are the module definition pins. They should be pulled up with a
4.7K – 10K resistor on the host board. The pull-up voltage shall be VccT or VccR (see Section IV for further details).
Mod-Def 0 is grounded by the module to indicate that the module is present Mod-Def 1 is the clock line of two wire serial interface for serial ID
Mod-Def 2 is the data line of two wire serial interface for serial ID
This is an optional input used to control the receiver bandwidth for compatibility with multiple data rates (most likely Fibre Channel 1x and 2x Rates). If implemented, the input will be internally pulled down with > 30k resistor. The input states are:
Low (0 – 0.8V): Reduced Bandwidth (>0.8 , < 2.0V): Undefined
High (2.0 – 3.465V): Full Bandwidth Open: Reduced Bandwidth
LOS (Loss of Signal) is an open collector/drain output, which should be pulled up with a
4.7K – 10K resistor. Pull up voltage between 2.0V and VccT, R+0.3V. When high, this output indicates the received optical power is below the worst-case receiver sensitivity (as defined by the standard in use). Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.
VeeR and VeeT may be internally connected within the SFP module.
RD-/+: These are the differential receiver outputs. They are AC coupled 100 differential lines which should be terminated with 100 (differential) at the user SERDES. The AC coupling is done inside the module and is thus not required on the host board. The voltage swing on these lines will be between 370 and 2000 mV differential (185 – 1000 mV single ended) when properly terminated.
VccR and VccT are the receiver and transmitter power supplies. They are defined as 3.3V
5% at the SFP connector pin. Maximum supply current is 300 mA. Recommended host board power supply filtering is shown below. Inductors with DC resistance of less than 1 should be used in order to maintain the required voltage at the SFP input pin with 3.3V supply voltage. When the recommended supply filtering network is used, hot plugging of the SFP transceiver module will result in an inrush current of no more than 30 mA greater than the steady state value. VccR and VccT may be internally connected within the SFP transceiver module.
TD-/+: These are the differential transmitter inputs. They are AC-coupled, differential lines with 100 differential termination inside the module. The AC coupling is done inside the module and is thus not required on the host board. The inputs will accept differential swings of 500 – 2400 mV (250 – 1200 mV single-ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single-ended) be used for best EMI performance.
0.1 uF
1 uH
0.1 uF
10 uF
0.1 uF
10 uF
VccT
VccR
SFP Module
3.3 V
Host Board
Protocol Vcc
1 uH
3.3 V
1 uH
10 uF .1uF
SFP
Module
Protocol Vcc
4.7k to 10k Ohms
.1uF
Vcc,T
4.7k to 10k Ohms
Tx_Disable
Tx_Disable
Tx_Fault
Tx_Fault
TD +
.01uF
TD -
100 Ohms
Laser Driver
.01uF
Gnd,T
Protocol IC
SerDes IC
10 uF .1uF
Vcc,R
4.7k to 10k Ohms
RD +
.01uF
100 Ohms
RD -
Preamp & Quantizer
.01uF
Rx_LOS
Rx_LOS
Rx_Rate
Rx_Rate
3.3 V
Gnd,R
30k Ohms
4.7k to 10k Ohms
PLD / PAL
4.7k to 10k Ohms
4.7k to 10k Ohms
Mod_def 0 Mod_def 1 Mod_def 2
The timing requirements of the control and status lines are drawn largely from the GBIC standard at the time of writing. They are summarized in Table 2 below:
Parameter | Symbol | Min | Max | Unit | Condition |
TX Disable Assert Time | t_off | 10 | s | Time from rising edge of TX Disable to when the optical output falls below 10% of nominal | |
TX Disable Negate Time | t_on | 1 | ms | Time from falling edge of TX Disable to when the modulated optical output rises above 90% of nominal | |
Time to initialize, including reset of TX_Fault | t_init | 300 | ms | From power on or negation of TX Fault using TX Disable | |
TX Fault Assert Time | t_fault | 100 | s | Time from fault to TX fault on. | |
TX Disable to reset | t_reset | 10 | s | Time TX Disable must be held high to reset TX_fault | |
LOS Assert Time | t_loss_on | 100 | s | Time from LOS state to RX LOS assert | |
LOS Deassert Time | t_loss_off | 100 | s | Time from non-LOS state to RX LOS deassert | |
Rate-Select Change Time | t_ratesel | 10 | s | Time from rising or falling edge of Rate Select input until receiver bandwidth is in conformance with appropriate specification. | |
Serial ID Clock Rate | f_serial_clock | 100 | kHz |
During power on of the SFP transceiver, TX_FAULT, if implemented, may be asserted (High) as soon as power supply voltages are within specification. For transceiver initialization with TX_DISABLE negated, TX_FAULT shall be negated when the transmitter safety circuitry, if implemented, has detected that the transmitter is operating in its normal state. If a transmitter fault has not occurred, TX_FAULT shall be negated within a period t_init from the time that VCCT exceeds the specified minimum operating voltage (see Table 2). If TX_FAULT remains asserted beyond the period t_init, the host may assume that a transmission fault has been detected by the transceiver.
If no transmitter safety circuitry is implemented, the TX_FAULT signal may be tied to its negated state.
The power-on initialization timing for a transceiver with TX_DISABLE negated is shown in Figure 3.
For SFP transceiver power on initialization with TX_DISABLE asserted, the state of TX_FAULT is not defined while TX_DISABLE is asserted. After TX_DISABLE is negated, TX_FAULT may be asserted while safety circuit initialization is performed. TX_FAULT shall be negated when the transmitter safety circuitry, if implemented, has detected that the transmitter is operating in its normal state. If a transmitter fault has not occurred, TX_FAULT shall be negated within a period t_init from the time that TX_DISABLE is negated. If TX_FAULT remains asserted beyond the period t_init, the host may assume that a transmission fault has been detected by the transceiver.
If no transmitter safety circuitry is implemented, the TX_FAULT signal may be tied to its negated state. The power-on initialization timing for a SFP transceiver with TX_DISABLE asserted is shown in Figure 4.
When a transceiver is not installed, TX_FAULT is held to the asserted state by the pull up circuits on the host. As the SFP transceiver is installed, contact is made with the ground, voltage, and signal contacts in the specified order. After the SFP has determined that VCCT has reached the specified value, the power on initialization takes place as described in the above sections. An example of initialization during hot plugging is provided in Figure 5.
The timing requirements for the management of optical outputs from the SFP transceiver using the TX_DISABLE signal are shown in Figure 6. Note that the t on time refers to the maximum delay until the modulated optical signal reaches 90% of the final value, not just the average optical power.
TX_FAULT shall be implemented by those module definitions of SFP transceiver supporting safety circuitry. If TX_FAULT is not implemented, the signal shall be held to the low state by the SFP transceiver.
The detection of a safety-related transmitter fault condition presented by TX_FAULT shall be latched. The following protocol may be used to reset the latch in case the transmitter fault condition is transient. To reset the fault condition and associated detection circuitry, TX_DISABLE shall be asserted for a minimum of t_reset. TX_DISABLE shall then be negated. In less than the maximum value of t_init the optical transmitter will correctly reinitialize the laser circuits, negate TX_FAULT, and begin normal operation if the fault condition is no longer present. If a fault condition is detected during the reinitialization, TX_FAULT shall again be asserted, the fault condition again latched, and the optical transmitter circuitry will again be disabled until the next time a reset protocol is attempted. The manufacturer of the SFP shall ensure that the optical power emitted from an open connector or fiber is compliant with IEC825-1 and CDRH during all reset attempts, during normal operation or upon the occurrence
of reasonable single fault conditions. The SFP transceiver may require internal protective circuitry to prevent the frequent assertion of the TX_DISABLE signal from generating frequent pulses of energy that violate the safety requirements. The timing for successful recovery from a transient safety fault condition is shown in Figure 8.
An example of an unsuccessful recovery, where the fault condition was not transient, is shown in Figure 9.
The LOS signal is intended as a preliminary indication to the system in which the SFP transceiver is installed that the link signals are likely to be outside the required values for proper operation. Such indications typically point to non-installed cables, broken cables, or a disabled, failing or powered off transmitter at the far end of the cable. Additional indications are provided by the system in which the SFP transceiver is installed to verify that the information being transmitted is valid, correctly encoded, and in the correct format. Such additional indications are outside the scope of the SFP TRANSCEIVER MSA.
The timing of the LOS function is specified in Figure 10.
The definition of the MOD-DEF function is drawn largely from the GBIC standard with some small, but backwards compatible, changes to the fields or allowed values to reflect the latest standards and expectations for these transceivers. In some cases, this backward compatibility approach results in the possibility of illegal combinations (such as defining an SFP module with SC optical connectors). Some locations previously reserved in the GBIC serial identification have now been defined.
It should be noted that only the serial module definition and the basic Mod-Def 0 indication of module present are implemented. The use of MOD DEF lines as static codes for module definition as done with GBIC are not implemented.
The SFP serial ID provides access to sophisticated identification information that describes the transceiver’s capabilities, standard interfaces, manufacturer, and other information. The serial interface uses the 2-wire serial CMOS E2PROM protocol defined for the ATMEL AT24C01A/02/04 family of components.
When the serial protocol is activated, the host generates the serial clock signal (SCL, Mod Def 1). The positive edge clocks data into those segments of the E2PROM that are not write- protected within the SFP transceiver. The negative edge clocks data from the SFP transceiver.
The serial data signal (SDA, Mod Def 2) is bi-directional for serial data transfer. The host uses SDA in conjunction with SCL to mark the start and end of serial protocol activation. The memories are organized as a series of 8-bit data words that can be addressed individually or sequentially.
This section defines the information structures that are obtained from the SFP transceiver via the serial ID.
A SFP transceiver shall meet the electrical and optical requirements, including amplitude, eye diagram, jitter, and other parameters, specified for the standards with which the transceiver claims compliance.
The 2-wire serial CMOS E2PROM provides sequential or random access to 8 bit parameters, addressed from 0000h to the maximum address of the memory. The address select pins for the serial CMOS E2PROM shall be set to zero (fixed at the VIL low level). The fields specified by this section shall not be written by the host in which it is installed. The SFP transceiver may enforce this by using the write protect features of the CMOS E2PROM.
The word address is transmitted with the high order bit transmitted first. The protocol for the 2- wire serial interface sequentially transmits one or more 8-bit bytes, with the data byte addressed by the lowest word address transmitted first. In each data byte, the high order bit (bit 7 in the accompanying tables) is transmitted first.
Numeric fields are expressed in binary, with the high order byte being transferred first and the high order bit of each byte being transferred first. Numeric fields are padded on the left with binary zero values.
Character strings are ordered with the first character to be displayed located in the lowest word address of the string. Each character shall be coded as a US-ASCII character as defined by ISO 8859-1, with the high order bit transmitted first. All character strings will be padded on the right with ASCII spaces (20h) to fill empty bytes.
All bits of reserved fields shall be set to zero until future definitions require their use. A minimum of 96 bytes shall be readable by the serial identification process.
The maximum clock rate of the serial interface shall be 100 KHz.
The following tables define the contents of the serial CMOS E2PROM. The first table is a summary of all the data fields in the serial ID chip. The remaining tables contain detailed descriptions of the individual data fields.
Data Address | Field Size (Bytes) | Name of field | Description of field |
BASE ID FIELDS | |||
0 | 1 | Identifier | Type of serial transceiver (see Table 3.2) |
1 | 1 | Ext. Identifier | Extended identifier of type of serial transceiver |
2 | 1 | Connector | Code for connector type (see Table 3.3) |
3-10 | 8 | Transceiver | Code for electronic compatibility or optical compatibility (see Table 3.4) |
11 | 1 | Encoding | Code for serial encoding algorithm (see Table 3.5) |
12 | 1 | BR, Nominal | Nominal bit rate, units of 100 MBits/sec. |
13 | 1 | Reserved | |
14 | 1 | Length(9m) - km | Link length supported for 9/125 mm fiber, units of km |
15 | 1 | Length (9m) | Link length supported for 9/125 mm fiber, units of 100 m |
16 | 1 | Length (50m) | Link length supported for 50/125 mm fiber, units of 10 m |
17 | 1 | Length (62.5m) | Link length supported for 62.5/125 mm fiber, units of 10 m |
18 | 1 | Length (Copper) | Link length supported for copper, units of meters |
19 | 1 | Reserved | |
20-35 | 16 | Vendor name | SFP transceiver vendor name (ASCII) |
36 | 1 | Reserved | |
37-39 | 3 | Vendor OUI | SFP transceiver vendor IEEE company ID |
40-55 | 16 | Vendor PN | Part number provided by SFP transceiver vendor (ASCII) |
56-59 | 4 | Vendor rev | Revision level for part number provided by vendor (ASCII) |
60-62 | 3 | Reserved | |
63 | 1 | CC_BASE | Check code for Base ID Fields (addresses 0 to 62) |
EXTENDED ID FIELDS | |||
64-65 | 2 | Options | Indicates which optional SFP signals are implemented (see Table 3.6) |
66 | 1 | BR, max | Upper bit rate margin, units of % |
67 | 1 | BR, min | Lower bit rate margin, units of % |
68-83 | 16 | Vendor SN | Serial number provided by vendor (ASCII) |
84-91 | 8 | Date code | Vendor’s manufacturing date code (see Table 3.7) |
92-94 | 3 | Reserved | |
95 | 1 | CC_EXT | Check code for the Extended ID Fields (addresses 64 to 94) |
VENDOR SPECIFIC ID FIELDS | |||
96-127 | 32 | Read-only | Vendor specific data, read only |
128-511 | 384 | Reserved | |
512-n | Vendor specific |
The identifier value specifies the physical device described by the serial information. This value shall be included in the serial data. The defined identifier values are shown in Table 3.2.
Table 3.2. Identifier Values
Value | Description of Physical Device |
00h | Unknown or unspecified |
01h | GBIC |
02h | Module/connector soldered to motherboard |
03h | SFP transceiver |
04-7Fh | Reserved |
80-FFh | Vendor specific |
The field should be set to 04h for all SFP modules indicating serial ID module definition.
The Connector value indicates the external connector provided on the interface. This value shall be included in the serial data. The defined connector values are shown in Table 3.3. Note that 01h – 05h are not SFP compatible, and are included for compatibility with GBIC standards
Value | Description of Connector |
00h | Unknown or unspecified |
01h | SC |
02h | Fibre Channel Style 1 copper connector |
03h | Fibre Channel Style 2 copper connector |
04h | BNC/TNC |
05h | Fibre Channel coaxial headers |
06h | FiberJack |
07h | LC |
08h | MT-RJ |
09h | MU |
0Ah | SG |
0Bh | Optical pigtail |
0C-1Fh | Reserved |
20h | HSSDC II |
21h | Copper Pigtail |
22h-7Fh | Reserved |
80-FFh | Vendor specific |
The following bit significant indicators define the electronic or optical interfaces that are supported by the SFP transceiver. At least one bit shall be set in this field. For Fibre Channel SFPs, the Fibre Channel speed, transmission media, transmitter technology, and distance capability shall all be indicated.
Data Addr | Bit1 | Description of transceiver | Data Addr | Bit1 | Description of transceiver |
Reserved Standard Compliance Codes | Fibre Channel link length | ||||
3 | 7-0 | Reserved | 7 | 7 | very long distance (V) |
4 | 7-4 | Reserved | 7 | 6 | short distance (S) |
SONET Compliance Codes | 7 | 5 | intermediate distance (I) | ||
4 | 3 | Reserved | 7 | 4 | long distance (L) |
4 | 2 | OC 48, long reach | Fibre Channel transmitter technology | ||
4 | 1 | OC 48, intermediate reach | 7 | 3-2 | Reserved |
4 | 0 | OC 48 short reach | 7 | 1 | Longwave laser (LC) |
5 | 7 | Reserved | 7 | 0 | Electrical inter-enclosure (EL) |
5 | 6 | OC 12, single mode long reach | 8 | 7 | Electrical intra-enclosure (EL) |
5 | 5 | OC 12, single mode inter. reach | 8 | 6 | Shortwave laser w/o OFC (SN) |
5 | 4 | OC 12 multi-mode short reach | 8 | 5 | Shortwave laser w/ OFC (SL) |
5 | 3 | Reserved | 8 | 4 | Longwave laser (LL) |
5 | 2 | OC 3, single mode long reach | 8 | 0-3 | Reserved |
5 | 1 | OC 3, single mode inter. reach | |||
5 | 0 | OC 3, multi-mode short reach | Fibre Channel transmission media | ||
9 | 7 | Twin Axial Pair (TW) | |||
9 | 6 | Shielded Twisted Pair (TP) | |||
9 | 5 | Miniature Coax (MI) | |||
Gigabit Ethernet Compliance Codes | 9 | 4 | Video Coax (TV) | ||
6 | 7-4 | Reserved | 9 | 3 | Multi-mode, 62.5m (M6) |
6 | 3 | 1000BASE-T | 9 | 2 | Multi-mode, 50 m (M5) |
6 | 2 | 1000BASE-CX | 9 | 1 | Reserved |
6 | 1 | 1000BASE-LX | 9 | 0 | Single Mode (SM) |
6 | 0 | 1000BASE-SX | |||
Fibre Channel speed | |||||
10 | 7-5 | Reserved | |||
10 | 4 | 400 MBytes/Sec | |||
10 | 3 | Reserved | |||
10 | 2 | 200 MBytes./Sec | |||
10 | 1 | Reserved | |||
10 | 0 | 100 MBytes/Sec |
1 Bit 7 is the high order bit and is transmitted first in each byte.
The encoding value indicates the serial encoding mechanism that is the nominal design target of the particular SFP transceiver. The value shall be contained in the serial data. The defined encoding values are shown in Table 3.5.
code | Description of encoding mechanism |
00h | Unspecified |
01h | 8B10B |
02h | 4B5B |
03h | NRZ |
04h | Manchester |
05h -FFh | Reserved |
The nominal bit rate (BR, nominal) is specified in units of 100 Megabits per second, rounded off to the nearest 100 Megabits per second. The bit rate includes those bits necessary to encode and delimit the signal as well as those bits carrying data information. A value of 0 indicates that the bit rate is not specified and must be determined from the transceiver technology. The actual information transfer rate will depend on the encoding of the data, as defined by the encoding value.
Addition to EEPROM data from original GBIC definition. This value specifies the link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using single mode fiber. The value is in units of kilometers. A value of 255 means that the transceiver supports a link length greater than 254 km. A value of zero means that the transceiver does not support single mode fiber or that the length information must be determined from the transceiver technology.
This value specifies the link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using single mode fiber. The value is in units of 100 meters. A value of 255 means that the transceiver supports a link length greater than 25.4 km. A value of zero means that the SFP transceiver does not support single mode fiber or that the length information must be determined from the transceiver technology.
This value specifies the link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using 50 micron multi-mode fiber. The value is in units of 10 meters. A value of 255 means that the SFP transceiver supports a link length greater than 2.54 km. A value of zero means that the transceiver does not support 50 micron multi-mode fiber or that the length information must be determined from the transceiver technology.
This value specifies the link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using 62.5 micron multi-mode fiber. The value is in units of 10 meters. A value of 255 means that the SFP transceiver supports a link length greater than 2.54 km. A value of zero means that the SFP transceiver does not 62.5 micron multi-mode fiber or that the length information must determined from the transceiver technology. It is common for the SFP transceiver to support both 50 micron and 62.5 micron fiber.
This value specifies the minimum link length that is supported by the SFP transceiver while operating in compliance with the applicable standards using copper cable. The value is in units of 1 meter. A value of 255 means that the SFP transceiver supports a link length greater than 254 meters. A value of zero means that the SFP transceiver does not support copper cables or that the length information must be determined from the transceiver technology. Further information about the cable design, equalization, and connectors is usually required to guarantee meeting a particular length requirement.
The vendor name is a 16 character field that contains ASCII characters, left-aligned and padded on the right with ASCII spaces (20h). The vendor name shall be the full name of the corporation, a commonly accepted abbreviation of the name of the corporation, the SCSI company code for the corporation, or the stock exchange code for the corporation. At least one of the vendor name or the vendor OUI fields shall contain valid serial data.
The vendor organizationally unique identifier field (vendor OUI) is a 3-byte field that contains the IEEE Company Identifier for the vendor. A value of all zero in the 3-byte field indicates that the Vendor OUI is unspecified.
The vendor part number (vendor PN) is a 16-byte field that contains ASCII characters, left- aligned and padded on the right with ASCII spaces (20h), defining the vendor part number or product name. A value of all zero in the 16-byte field indicates that the vendor PN is unspecified.
The vendor revision number (vendor rev) is a 4-byte field that contains ASCII characters, left- aligned and padded on the right with ASCII spaces (20h), defining the vendor’s product revision number. A value of all zero in the 4-byte field indicates that the vendor Rev is unspecified.
The check code is a one byte code that can be used to verify that the first 64 bytes of serial information in the SFP transceiver is valid. The check code shall be the low order 8 bits of the sum of the contents of all the bytes from byte 0 to byte 62, inclusive.
The bits in the option field shall specify the options implemented in the SFP transceiver as described in Table 3.6.
data address | bit | Description of option |
64 | 7-0 | Reserved |
65 | 7-6 | Reserved |
65 | 5 | RATE_SELECT is implemented If bit is set then active control of the rate select pin is required to change rates. If bit is not set, no control of pin is required. In all cases, compliance with multiple rate standards should be determined by Transceiver Codes in Bytes 4, 5, 6 and 10. (See Table 3.4) |
65 | 4 | TX_DISABLE is implemented and disables the serial output. |
65 | 3 | TX_FAULT signal implemented. (Reset defined in section III) |
65 | 2 | Loss of Signal implemented, signal inverted from definition in Table 1 NOTE: This is not standard SFP transceiver behavior and should be avoided, since non-interoperable behavior results. |
65 | 1 | Loss of Signal implemented, signal as defined in Table 1 |
65 | 0 | Reserved |
The upper bit rate limit at which the SFP transceiver will still meet its specifications (BR, max) is specified in units of 1% above the nominal bit rate. A value of zero indicates that this field is not specified.
The lower bit rate limit at which the SFP transceiver will still meet its specifications (BR, min) is specified in units of 1% below the nominal bit rate. A value of zero indicates that this field is not specified.
The vendor serial number (vendor SN) is a 16 character field that contains ASCII characters, left-aligned and padded on the right with ASCII spaces (20h), defining the vendor’s serial number for the SFP transceiver. A value of all zero in the 16-byte field indicates that the vendor SN is unspecified.
The date code is an 8-byte field that contains the vendor’s date code in ASCII characters. The date code is mandatory. The date code shall be in the format specified by Table 3.7.
Data Address | Description of field |
84-85 | ASCII code, two low order digits of year. (00 = 2000). |
86-87 | ASCII code, digits of month (01 = Jan through 12 = Dec) |
88-89 | ASCII code, day of month (01 - 31) |
90-91 | ASCII code, vendor specific lot code, may be blank |
The check code is a one byte code that can be used to verify that the first 32 bytes of extended serial information in the SFP transceiver is valid. The check code shall be the low order 8 bits of the sum of the contents of all the bytes from byte 64 to byte 94, inclusive.
This area may contain vendor specific information which can be read from the SFP transceiver. The data is read only.